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Multiquip Tuck Point Blades Wafer Segmented

DRY/WET Cutting – Premium Grade
Wafer blade design for lightning fast material removal.
Cleans, routs mortar and masonry materials.
1/4 and 3/8 in wafer widths available.
Blade Diameters for Right Angle Grinders & Circular Saws.
Reference Series: WTK

Multiquip Tuck Point Blades Wafer Segmented

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