Multiquip Tuck Point Blades Wafer Segmented

Multiquip Tuck Point Blades Wafer Segmented

Multiquip Tuck Point Blades Wafer Segmented Information

DRY/WET Cutting – Premium Grade
Wafer blade design for lightning fast material removal.
Cleans, routs mortar and masonry materials.
1/4 and 3/8 in wafer widths available.
Blade Diameters for Right Angle Grinders & Circular Saws.
Reference Series: WTK

Engine

HORSEPOWERNA

Performance

Capacities

List of Features

  • View description for list of features...
*New price, if shown, is Suggested List Price (SLP). Current national programs are subtracted. SLP and/or final actual sales price will vary depending on options or accessories selected.
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Manufacturer Multiquip
Category Diamond Cutting Tools
Subcategory MQ Diamond Blades
Model Tuck Point Blades - Wafer Segmented
Condition New
Hours 0
Horsepower NA
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